Memory
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build high-capacity and high-performance SSDs, which will help to solidify Samsung's position in the storage market. Diving right in, Samsung is conspicuously avoiding to list the number of layers in their latest generation NAND, which is the principle driving factor in increasing capacity generation-on-generation. The company's current 8th gen V-NAND is 236 layers – similar to its major competitors – and word on the street is that 9th gen V-NAND ups...
Micron Kicks Off Production of HBM3E Memory
Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200...
8 by Anton Shilov on 2/26/2024Rambus Preps Updated RCD for Server-Grade DDR5-7200 Modules
Rambus has introduced its fourth-generation registering clock driver (RCD) chip for server-grade DDR5 memory modules. The updated RCD chip brings support for higher clockspeeds on DDR5 RDIMMs, allowing for...
7 by Anton Shilov on 1/3/2024G.Skill and V-Color Unveil Factory Overclocked ECC RDIMMs for Ryzen Threadripper 7000 [UPDATED]
UPDATE 11/24: Demu, our reader with sharp eyes, notified us that Gigabyte had published a list of overclockable RDIMMs with ECC and AMD EXPO profiles supported by its TRX50...
7 by Anton Shilov on 11/23/2023SK hynix Ships LPDDR5T: 9600 MT/s Memory for Smartphones
SK hynix had started volume shipments of its LPDDR5T-9600 memory for high-end smartphones, the company announced this week. So far, the company's LPDDR6 'Turbo' memory with a 9600 MT/s...
17 by Anton Shilov on 11/14/2023Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 Gb Die
The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging...
15 by Ganesh T S on 11/9/2023Solidigm Lays Off Employees Due to Industry Downturn
The solid state storage industry has been in a well-documented slide for the better part of the last year now. With storage product demand from both the client and...
18 by Anton Shilov on 10/25/2023Micron and SK hynix Ship LPDDR5-9600 Memory for Next-Gen Smartphones
Fast memory is crucial for the performance of high-end system-on-chips that are getting more sophisticated every year. When it comes to smartphones, the most obvious way to boost memory...
23 by Anton Shilov on 10/25/2023Samsung Announces 'Shinebolt' HBM3E Memory: HBM Hits 36GB Stacks at 9.8 Gbps
Samsung’s annual Memory Tech Day is taking place in San Jose this morning, and as part of the event, the company is making a couple of notable memory technology...
10 by Ryan Smith on 10/20/2023HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1...
11 by Anton Shilov on 10/12/2023Micron to Ship HBM3E Memory to NVIDIA in Early 2024
Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...
7 by Anton Shilov on 9/28/2023Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs
Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32...
9 by Anton Shilov on 9/28/2023Corsair's Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s
Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together luxurious look, customizable design, and extreme data transfer...
1 by Anton Shilov on 9/26/2023Modular LPDDR Memory Becomes A Reality: Samsung Introduces LPCAMM Memory Modules
Although Low Power DDR(LPDDR) memory has played a pivotal role in reducing PC laptop power usage, the drawback to the mobile-focused memory has always been its tight signaling and...
30 by Ryan Smith on 9/25/2023Samsung Unveils Industry's First 32Gbit DDR5 Memory Die: 1TB Modules Incoming
Samsung early on Friday revealed the world's first 32 Gb DDR5 DRAM die. The new memory die is made on the company's 12 nm-class DRAM fabrication process and not...
6 by Anton Shilov on 9/1/2023SK hynix Begins Sampling HBM3e, Volume Production Planned For H1 2024
SK hynix on Monday announced that it had completed initial development of its first HBM3E memory stacks, and has begun sampling the memory to a customer. The updated ("extended"...
4 by Anton Shilov on 8/21/2023Samsung, MemVerge, and H3 Build 2TB CXL Memory Pool
Samsung, MemVerge, H3 Platform, and XConn have jointly unveiled their 2 TB Pooled CXL Memory System at the Flash Memory Summit. The device can be connected to up to...
4 by Anton Shilov on 8/14/2023SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC
On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company's LPDDR5X-8500 devices...
10 by Anton Shilov on 8/11/2023Memory Makers on Track to Double HBM Output in 2023
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...
9 by Anton Shilov on 8/9/2023SK Hynix Shows Off 321-Layer 3D TLC NAND Device
SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with...
11 by Anton Shilov on 8/9/2023Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB
This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions. Modern server platforms from...
7 by Anton Shilov on 8/9/2023