Hot Chips 31 Live Blogs: Intel Lakefield and Foverosby Dr. Ian Cutress on August 20, 2019 7:10 PM EST
07:14PM EDT - One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is called Foveros, and today we have a talk on the chip.
07:15PM EDT - Going to start in a minute or so
07:17PM EDT - We know a lot about Lakefield and Foveros: stacked logic and IO die, with POP DRAM. Hybrid x86 with 1x Sunny Cove and 4x Tremont
07:17PM EDT - This is the packaging session on Hot Chips, so we might learn more about the Foveros
07:17PM EDT - Lakefield for smartphone and laptops
07:18PM EDT - Best in class compute in smaller form factor
07:18PM EDT - Customer request
07:18PM EDT - Lots of requirements, including 10nm and 2mW standby Power
07:19PM EDT - Also had to be small
07:19PM EDT - and high performance
07:20PM EDT - Compute Die, base die, and 4GB (4 Gb?) memory on top
07:20PM EDT - 1mm z-height with post-SMT
07:21PM EDT - 30x123 PCB for full compute on a PCB
07:21PM EDT - SMallest ever Intel complete solution
07:22PM EDT - Competitor PCB is 43x286 mm
07:22PM EDT - Competitor has onboard LTE modem, Intel does not
07:22PM EDT - LKF Clamshell AEP is what we'll see in notebooks
07:22PM EDT - PCB is 10 layer
07:23PM EDT - SPI-less boot from UFS
07:23PM EDT - Comparing last gen Y CPU vs LKF
07:24PM EDT - Amber vs Ice-Y vs Lakefield
07:24PM EDT - Power Delivery is PMIC
07:24PM EDT - Two PMICs in LKF, one for Compute die, one for IO die
07:25PM EDT - Compute in 10+
07:25PM EDT - (Once Again, the computer with the demonstration doesn't have the Intel font)
07:25PM EDT - 1x Sunny Cove + 4x Tremont
07:26PM EDT - Can support up to 6 cameras
07:26PM EDT - Gen 11 graphics, 64 EUs
07:26PM EDT - Base Die is P1222
07:28PM EDT - P1222 is 10nm
07:28PM EDT - 7nm in development
07:28PM EDT - Sorry, P1222 isn't 10nm. it's 14nm
07:28PM EDT - Multi-die behaving like a monolithic die
07:29PM EDT - Allows IPs to be developed independently, faster time to market
07:29PM EDT - Plan to make many more stacked SoCs
07:30PM EDT - (This new slide doesn't even have a capital L for Lakefield)
07:31PM EDT - 4 GB DRAM, or 8 GB LPDDR4X solution
07:31PM EDT - Now hybrid Compute
07:32PM EDT - Low power scenarios key to battery life run on Tremont
07:32PM EDT - There are power/perf curves for Sunny vs Tremont
07:33PM EDT - ST perf on SNC, low power on Tremont
07:34PM EDT - This slides also say it's better to run MT on Tremont
07:34PM EDT - So Sunny is only used for response-type latency workloads
07:34PM EDT - (What this means for multiple workloads running at the same time)
07:35PM EDT - (The person who made these slides really doesn't like capital letters in titles)
07:35PM EDT - Hybrid Architecture shows TNT as base, with SNC being run in specific sections
07:36PM EDT - Standby power is 0.08x over Skylake
07:37PM EDT - Vnn removal, LDO removal, low leakage power
07:37PM EDT - No need to use high perf transistors here. Can take advantage of low leakage transistors
07:38PM EDT - First PC Compute SoC
07:38PM EDT - First phase of production, targeting readiness in Q4 2019
07:39PM EDT - Q&A?
07:39PM EDT - Q: Is it 10 or 10+? A: 10+
07:40PM EDT - Q: Interconnect between IO die and Compute die? A: Cut serialization and made it vertical
07:40PM EDT - Q: Face to face bonding of two dies? A: Yes
07:41PM EDT - Q: How is power and IO delivered through that connect? A: Combination of TSVs
07:42PM EDT - Q: pitch of microbumps? A: 50 micron pitch, 20 micron height
07:42PM EDT - Q: Can all the dies function independently or together? A: Can function independently like a normal PC
07:44PM EDT - Q: Penalty for keepaway from vias? A: The design rules are very forgiving - there are many classes of circuits that can be next to vias that can make it work. You won't use high speed, but on this product it was very easy to deliver.
07:45PM EDT - Q: Can you scale to higher power, with like a discrete GPU on top? How does that affect die rules? A: We don't see power limits, we think it will scan the entire range of the spectrum. Or the die to die scaling. It's a question of technology and ramping, then power delivery. It's all about working out the losses. We don't see a big limit from limiting 3D stacking.
07:46PM EDT - Q: Can you stack more dies? Thermals? A: Foveros is CoWoP with Silicon on Silicon, there should be no limit. Benefits of attaching many chiplets. Other pratical limits in architecture partitioning. Our goal is to drive it to many chiplets.
07:46PM EDT - That's a wrap. Now Xeon Jintide!
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voicequal - Tuesday, August 20, 2019 - linkNow if Intel would price it under $5 it could be the SoC for Raspberry Pi 5.
Eris_Floralia - Tuesday, August 20, 2019 - linkLKF is for premium mobile. $500 maybe.
HStewart - Thursday, August 22, 2019 - linkBig difference is Lakefield probably could emulate Raspberry PI.
Eris_Floralia - Tuesday, August 20, 2019 - link*P1222 is 22FFL used for base io die
ToTTenTranz - Wednesday, August 21, 2019 - linkThe purpose of this is to go against Windows on ARM?
Love how the presenter's hatred of capital letters on slides is challenging Ian's OCD on the subject, BTW.
HStewart - Thursday, August 22, 2019 - linkBig advantages of Windows for ARM (QuallComm) is that Lakefield does not have run applications in Emulation mode. Which likely the Tremont cores run faster than Windows for ARM.
I am curious is there a Windows for ARM emulator out there, Lakefield could probably run it faster
Wilco1 - Thursday, August 22, 2019 - linkI guess you must have missed the recent benchmarks that show QC 8cx beat i5-8250U by a good margin both emulated and native while still giving twice the battery life...
But your indisputable love for Intel means you cannot accept hard facts.
HStewart - Thursday, August 22, 2019 - linkI was referring to x86 applications and according to the link provided
"ARM native version of 3DMark Night Raid."
As a developer for 30 years, it takes a lot to port applications to new processor.
Korguz - Thursday, August 22, 2019 - linkWilco1 " But your indisputable love for Intel means you cannot accept hard facts. " exactly !!!
" As a developer for 30 years, " yea right, that's BS
Threska - Friday, August 23, 2019 - linkApple's move to x86 from PowerPC.