EUV
Taking place this week is the IEEE’s annual VLSI Symposium, one of the industry’s major events for disclosing and discussing new chip manufacturing techniques. One of the most anticipated presentations scheduled this year is from Intel, who is at the show to outline the physical and performance characteristics of their upcoming Intel 4 process, which will be used for products set to be released in 2023. The development of the Intel 4 process represents a critical milestone for Intel, as it’s the first Intel process to incorporate EUV, and it’s the first process to move past their troubled 10nm node – making it Intel’s first chance to get back on track to re-attaining fab supremacy. Intel’s scheduled to deliver their Intel 4 presentation on Tuesday...
Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton
Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...
21 by Anton Shilov on 12/11/2019
EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look
One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...
29 by Dr. Ian Cutress on 12/11/2019
TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm
TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...
27 by Anton Shilov on 10/23/2019
EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates
Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...
46 by Anton Shilov on 10/16/2019
Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...
12 by Dr. Ian Cutress on 8/20/2019
Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track
Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since...
42 by Anton Shilov on 7/31/2019
TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged
Development of new fabrication technologies never stops at leading-edge companies such as TSMC. Therefore, it is not surprising to hear the annoucement that development of TSMC’s 3nm node is...
76 by Anton Shilov on 7/23/2019
Micron’s DRAM Update: More Capacity, Four More 10nm-Class Nodes, EUV, 64 GB DIMMs
During its earnings conference call with investors and financial analysts earlier this week, Micron expressed confidence in its long-term future and strong demand for its products as new applications...
23 by Anton Shilov on 6/28/2019
Intel Process Technology Update: 10nm Server Products in 1H 2020, Accelerated 7nm in 2021
Intel provided an update regarding its upcoming fabrication technologies at its 2019 Investor Meeting. The company is on track to produce server-class products using its 10 nm manufacturing technology...
74 by Anton Shilov on 5/8/2019
TSMC: No Plans to Buy Rivals at The Moment
Although TSMC expects demand for chips to increase going forward and despite an ongoing trend towards consolidation on the foundry market, the company has commented that it currently has...
4 by Anton Shilov on 4/22/2019
Samsung Completes Development of 5nm EUV Process Technology
Samsung Foundry this week announced that it has completed development of its first-generation 5 nm fabrication process (previously dubbed 5LPE). The manufacturing technology uses extreme ultraviolet lithography (EUVL) and...
21 by Anton Shilov on 4/17/2019
TSMC Reveals 6 nm Process Technology: 7 nm with Higher Transistor Density
TSMC this week unveiled its new 6 nm (CLN6FF, N6) manufacturing technology, which is set to deliver a considerably higher transistor density when compared to the company's 7 nm...
23 by Anton Shilov on 4/17/2019
TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready
TSMC this week has said that it has completed development of tools required for design of SoCs that are made using its 5 nm (CLN5FF, N5) fabrication technology. The...
33 by Anton Shilov on 4/5/2019
SMIC To Start 14nm Mass Production in H1 2019
Reports have emerged this week that SMIC, the largest foundry in China, is set to start mass production using its in-house developed 14 nm FinFET manufacturing technology in the...
20 by Anton Shilov on 2/8/2019
ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming
ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...
17 by Anton Shilov on 1/28/2019
IBM to use Samsung 7nm EUV for Next-Gen POWER and z CPUs
IBM has announced it has signed an agreement with Samsung Foundry to produce its next-generation processors. This includes processors for IBM Power Systems, IBM z, and LinuxONE systems, all...
24 by Anton Shilov on 12/21/2018
Intel: EUV-Enabled 7nm Process Tech is on Track
Originally planned to enter mass production in the second half of 2016, Intel’s 10 nm process technology is still barely used by the company today. Currently the process is...
79 by Anton Shilov on 12/6/2018
Samsung Starts Mass Production of Chips Using Its 7nm EUV Process Tech
Samsung Foundry on Wednesday said that it had started production of chips using its 7LPP manufacturing technology that uses extreme ultraviolet lithography (EUVL) for select layers. The new fabrication...
42 by Billy Tallis & Anton Shilov on 10/17/2018
TSMC: First 7nm EUV Chips Taped Out, 5nm Risk Production in Q2 2019
Last week, TSMC made two important announcements concerning its progress with extreme ultraviolet lithography (EUVL). First up, the company has successfully taped out its first customer chip using its...
50 by Anton Shilov on 10/9/2018
Samsung Foundry Updates: 8LPU Added, EUVL on Track for HVM in 2019
Samsung recently hosted its Samsung Foundry Forum 2018 in Japan, where it made several significant foundry announcements. Besides reiterating plans to start high-volume manufacturing (HVM) using extreme ultraviolet lithography...
29 by Anton Shilov on 9/6/2018
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